W978H6KBVX2E

SKU: 15525

Manufacturer: Winbond Electronics

DRAM Chip Mobile LPDDR2 SDRAM 256Mbit 16Mx16 1.2V/1.8V 134-Pin VFBGA

560 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	175
Operating Temperature-Min	-25
Operating Temperature-Max	85
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	134
Terminal Form	Surface Mount
Package Height	0.58
Package Length	11.5
Package Width	10

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	175
Operating Temperature-Min	-25
Operating Temperature-Max	85
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	134
Terminal Form	Surface Mount
Package Height	0.58
Package Length	11.5
Package Width	10