W979H2KBQX2I

SKU: 150003

Manufacturer: Winbond Electronics

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 168-Pin WFBGA

540 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.32
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	175
Operating Temperature-Min	-40
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	WFBGA
Pin Count	168
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.32
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	512M
Organization	16Mx32
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	400
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	15
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	175
Operating Temperature-Min	-40
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	WFBGA
Pin Count	168
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12