EDB1332BDBH-1DIT-F-D

SKU: 32836

Manufacturer: Micron Technology

DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V/1.8V 134-Pin VFBGA

3190 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	1G
Organization	32Mx32
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	13
Interface Type	HSUL
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	180
Operating Temperature-Min	-40
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	VFBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58(Min)
Package Length	11.5
Package Width	10
PCB changed	134

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	1G
Organization	32Mx32
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	13
Interface Type	HSUL
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	180
Operating Temperature-Min	-40
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	VFBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58(Min)
Package Length	11.5
Package Width	10
PCB changed	134