S29WS512P0PBFW000

SKU: 122868

Manufacturer: Cypress - An Infineon Technologies Company

NOR Flash Parallel/Serial 1.8V 512M-bit 32M x 16 80ns 84-Pin VTFBGA Tray

980 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	Obsolete
HTS	8542.32.00.51
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	512M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	25
Sector Size	32Kbyte x 8
Bank Size	32/32/32/32/32/32/32/32/32/32/32/32/32/32/32/32Mb
Number of Banks	16
Page Size	8Words
Number of Bits/Word (bit)	16
Number of Words	32M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	80
Maximum Erase Time (s)	616/Chip
Maximum Page Access Time (ns)	20
Maximum Programming Time (ms)	1008000/Chip
OE Access Time (ns)	13.5
Process Technology	90nm
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Maximum Operating Frequency (MHz)	66
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Programming Voltage (V)	1.7 to 1.95
Operating Current (mA)	80
Page Read Current (mA)	15
Program Current (mA)	60
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Wireless
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000(Typ)
Packing Method	Tray
Original Package	VTFBGA
Pin Count	84
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.76(Max)
Package Length	11.6
Package Width	8
PCB changed	84

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	Obsolete
HTS	8542.32.00.51
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	512M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	25
Sector Size	32Kbyte x 8
Bank Size	32/32/32/32/32/32/32/32/32/32/32/32/32/32/32/32Mb
Number of Banks	16
Page Size	8Words
Number of Bits/Word (bit)	16
Number of Words	32M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	80
Maximum Erase Time (s)	616/Chip
Maximum Page Access Time (ns)	20
Maximum Programming Time (ms)	1008000/Chip
OE Access Time (ns)	13.5
Process Technology	90nm
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Maximum Operating Frequency (MHz)	66
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Programming Voltage (V)	1.7 to 1.95
Operating Current (mA)	80
Page Read Current (mA)	15
Program Current (mA)	60
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Wireless
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	100000(Typ)
Packing Method	Tray
Original Package	VTFBGA
Pin Count	84
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.76(Max)
Package Length	11.6
Package Width	8
PCB changed	84