S29PL064J70BFI120

SKU: 113159

Manufacturer: Cypress - An Infineon Technologies Company

NOR Flash Parallel 3V/3.3V 64M-bit 4M x 16 70ns 48-Pin FBGA Tray

10 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	64M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	22
Sector Size	8Kbyte x 16
Bank Size	8/8/24/24Mb
Number of Banks	4
Page Size	8Words
Number of Bits/Word (bit)	16
Number of Words	4M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	70
Maximum Erase Time (s)	113.6/Chip
Maximum Page Access Time (ns)	30
Maximum Programming Time (ms)	50400/Chip
OE Access Time (ns)	30
Process Technology	110nm
Interface Type	Parallel
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	55
Page Read Current (mA)	15
Program Current (mA)	25
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	1000000
Packing Method	Tray
Original Package	FBGA
Pin Count	48
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1(Max) - 0.18(Min)
Package Length	8.15
Package Width	6.15
PCB changed	48

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Obsolete
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	64M
Architecture	Sectored
Boot Block	Yes
Block Organization	Asymmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	22
Sector Size	8Kbyte x 16
Bank Size	8/8/24/24Mb
Number of Banks	4
Page Size	8Words
Number of Bits/Word (bit)	16
Number of Words	4M
Programmability	Yes
Timing Type	Asynchronous
Max. Access Time (ns)	70
Maximum Erase Time (s)	113.6/Chip
Maximum Page Access Time (ns)	30
Maximum Programming Time (ms)	50400/Chip
OE Access Time (ns)	30
Process Technology	110nm
Interface Type	Parallel
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	55
Page Read Current (mA)	15
Program Current (mA)	25
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	No
Support of Page Mode	Yes
Minimum Endurance (Cycles)	1000000
Packing Method	Tray
Original Package	FBGA
Pin Count	48
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	1(Max) - 0.18(Min)
Package Length	8.15
Package Width	6.15
PCB changed	48