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    ADN4651BRWZ

    SKU: 93560
    Manufacturer: Analog Devices
    LVDS Buffer 600Mbps 0.45V 20-Pin SOIC W Tube
    2060 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.39.00.01
    Automotive No
    PPAP No
    Function Buffer
    Transmission Data Rate (Mbps) 600
    Maximum Propagation Delay Time (ns) 4.5
    Input Signal Type LVDS
    Operating Supply Voltage-Min (V) 2.375
    Operating Supply Voltage-Max (V) 2.625
    Differential Input Low Threshold Voltage (V) -0.1(Min)
    Differential Input High Threshold Voltage (V) 0.1(Max)
    Maximum Differential Output Voltage (V) 0.45
    Typical Operating Supply Voltage (V) 3.3
    Maximum Input Current (uA) 5
    Maximum Power Dissipation (mW) 2780
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Supplier Temperature Grade Industrial
    Packing Method Tube
    Pin Count 20
    Standard Package Method SOP
    Original Package SOIC W
    Terminal Form Surface Mount
    Package Height 2.35(Max)
    Package Length 13(Max)
    Package Width 7.6(Max)
    PCB changed 20
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    HTS 8542.39.00.01
    Automotive No
    PPAP No
    Function Buffer
    Transmission Data Rate (Mbps) 600
    Maximum Propagation Delay Time (ns) 4.5
    Input Signal Type LVDS
    Operating Supply Voltage-Min (V) 2.375
    Operating Supply Voltage-Max (V) 2.625
    Differential Input Low Threshold Voltage (V) -0.1(Min)
    Differential Input High Threshold Voltage (V) 0.1(Max)
    Maximum Differential Output Voltage (V) 0.45
    Typical Operating Supply Voltage (V) 3.3
    Maximum Input Current (uA) 5
    Maximum Power Dissipation (mW) 2780
    Operating Temperature-Min -40
    Operating Temperature-Max 125
    Supplier Temperature Grade Industrial
    Packing Method Tube
    Pin Count 20
    Standard Package Method SOP
    Original Package SOIC W
    Terminal Form Surface Mount
    Package Height 2.35(Max)
    Package Length 13(Max)
    Package Width 7.6(Max)
    PCB changed 20