K4T51083QJ-BCE6000

SKU: 51861

Manufacturer: Samsung Electronics

DRAM Chip DDR2 SDRAM 512Mbit 64Mx8 1.8V 60-Pin FBGA

2070 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR2 SDRAM
Chip Density (bit)	512M
Organization	64Mx8
Number of Internal Banks	4
Number of Words per Bank	16M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	667
Maximum Access Time (ns)	0.45
Address Bus Width (bit)	16
Interface Type	SSTL_1.8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	96
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	9.5
Package Width	7.5
PCB changed	60

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Products specifications

EU RoHS	Supplier Unconfirmed
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	DDR2 SDRAM
Chip Density (bit)	512M
Organization	64Mx8
Number of Internal Banks	4
Number of Words per Bank	16M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	667
Maximum Access Time (ns)	0.45
Address Bus Width (bit)	16
Interface Type	SSTL_1.8
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	96
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	9.5
Package Width	7.5
PCB changed	60