K4F8E304HB-MGCJ

SKU: 111095

Manufacturer: Samsung Electronics

DRAM Chip Mobile LPDDR4 SDRAM 8Gbit 256Mx32 1.1V/1.8V 200-Pin FBGA

3030 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
DRAM Type	Mobile LPDDR4 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	3733
Interface Type	SSTL_2
Typical Operating Supply Voltage (V)	1.1
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	200
Terminal Form	Surface Mount
Package Length	15
Package Width	10

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
DRAM Type	Mobile LPDDR4 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	3733
Interface Type	SSTL_2
Typical Operating Supply Voltage (V)	1.1
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	200
Terminal Form	Surface Mount
Package Length	15
Package Width	10