K4F6E3S4HM-MGCJ

SKU: 30490

Manufacturer: Samsung Electronics

DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 512Mx32 1.1V/1.8V 200-Pin FBGA

4320 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR4 SDRAM
Chip Density (bit)	16G
Organization	512Mx32
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	3733
Maximum Access Time (ns)	3.5
Address Bus Width (bit)	19
Interface Type	LVSTL
Operating Supply Voltage-Min (V)	1.06
Typical Operating Supply Voltage (V)	1.1
Operating Supply Voltage-Max (V)	1.17
Operating Current (mA)	435
Operating Temperature-Min	-25
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	200
Terminal Form	Surface Mount
Package Height	0.68
Package Length	15
Package Width	10

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR4 SDRAM
Chip Density (bit)	16G
Organization	512Mx32
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	3733
Maximum Access Time (ns)	3.5
Address Bus Width (bit)	19
Interface Type	LVSTL
Operating Supply Voltage-Min (V)	1.06
Typical Operating Supply Voltage (V)	1.1
Operating Supply Voltage-Max (V)	1.17
Operating Current (mA)	435
Operating Temperature-Min	-25
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Original Package	FBGA
Pin Count	200
Terminal Form	Surface Mount
Package Height	0.68
Package Length	15
Package Width	10