K4B4G0846E-BCNB

SKU: 33293

Manufacturer: Samsung Electronics

DRAM Chip DDR3 SDRAM 4Gbit 512Mx8 1.5V 78-Pin FBGA

2030 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	4G
Organization	512Mx8
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	2133
Address Bus Width (bit)	19
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	95
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	11
Package Width	7.5
PCB changed	78

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR3 SDRAM
Chip Density (bit)	4G
Organization	512Mx8
Number of Internal Banks	8
Number of Words per Bank	64M
Number of Bits/Word (bit)	8
Data Bus Width (bit)	8
Maximum Clock Rate (MHz)	2133
Address Bus Width (bit)	19
Operating Supply Voltage-Min (V)	1.425
Typical Operating Supply Voltage (V)	1.5
Operating Supply Voltage-Max (V)	1.575
Operating Current (mA)	95
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	8
Original Package	FBGA
Pin Count	78
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	11
Package Width	7.5
PCB changed	78