K4A4G165WE-BCTD

SKU: 132414

Manufacturer: Samsung Electronics

DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA

6790 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2666
Maximum Access Time (ns)	0.17
Address Bus Width (bit)	20
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96

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Products specifications

ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2666
Maximum Access Time (ns)	0.17
Address Bus Width (bit)	20
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96