K4A4G165WE-BCRC

SKU: 75702

Manufacturer: Samsung Electronics

DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA

860 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2400
Maximum Access Time (ns)	0.175
Address Bus Width (bit)	20
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Current (mA)	129
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	DDR4 SDRAM
Chip Density (bit)	4G
Organization	256Mx16
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	2400
Maximum Access Time (ns)	0.175
Address Bus Width (bit)	20
Interface Type	POD
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.26
Operating Current (mA)	129
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	FBGA
Pin Count	96
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13.3
Package Width	7.5
PCB changed	96