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    MCIMX255AJM4A

    SKU: 20424
    Manufacturer: NXP Semiconductors
    SOC i.MX25 ARM926EJ-S 0.09um Automotive 400-Pin MAP-BGA Tray
    6270 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) 5A992
    Part Status Active
    HTS 8542.31.00.01
    Automotive Yes
    PPAP Unknown
    Family Name i.MX25
    Device Core ARM926EJ-S
    Maximum Clock Rate (MHz) 400
    Program Memory Type ROMless
    Data Bus Width (bit) 32
    RAM Size 128KB
    Type Applications Processor
    Processing Unit Microprocessor
    PWM 4
    Watchdog 1
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Interface Type CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB
    SPI 2
    I2C 3
    I2S 2
    UART 5
    Data Cache Size 16KB
    USB 2
    Instruction Cache Size 16KB
    USART 0
    CAN 2
    PCI 0
    Ethernet 1
    Programmability No
    Core Architecture ARM
    Ethernet Speed 10Mbps/100Mbps
    Packing Method Tray
    Original Package MAP-BGA
    Pin Count 400
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 1.18
    Package Length 17
    Package Width 17
    PCB changed 400
    Products specifications
    EU RoHS Compliant
    ECCN (US) 5A992
    Part Status Active
    HTS 8542.31.00.01
    Automotive Yes
    PPAP Unknown
    Family Name i.MX25
    Device Core ARM926EJ-S
    Maximum Clock Rate (MHz) 400
    Program Memory Type ROMless
    Data Bus Width (bit) 32
    RAM Size 128KB
    Type Applications Processor
    Processing Unit Microprocessor
    PWM 4
    Watchdog 1
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Interface Type CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB
    SPI 2
    I2C 3
    I2S 2
    UART 5
    Data Cache Size 16KB
    USB 2
    Instruction Cache Size 16KB
    USART 0
    CAN 2
    PCI 0
    Ethernet 1
    Programmability No
    Core Architecture ARM
    Ethernet Speed 10Mbps/100Mbps
    Packing Method Tray
    Original Package MAP-BGA
    Pin Count 400
    Standard Package Method BGA
    Terminal Form Surface Mount
    Package Height 1.18
    Package Length 17
    Package Width 17
    PCB changed 400