BLS6G2731S-130

SKU: 60701

Manufacturer: NXP Semiconductors

Trans RF FET N-CH 60V 33A 3-Pin CDFM

10 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
Configuration	Single
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Mode of Operation	Pulsed RF
Process Technology	LDMOS
Maximum Drain Source Voltage (V)	60
Maximum Gate Source Voltage (V)	13
Maximum VSWR	5
Maximum Continuous Drain Current (A)	33
Maximum Drain Source Resistance (mOhm)	135@6.15V
Typical Forward Transconductance (S)	13
Output Power (W)	130(Typ)
Typical Power Gain (dB)	12
Maximum Frequency (MHz)	3100
Minimum Frequency (MHz)	2700
Typical Fall Time (ns)	6
Typical Rise Time (ns)	20
Typical Drain Efficiency (%)	47
Operating Temperature-Min	-65
Operating Temperature-Max	200
Original Package	CDFM
Pin Count	3
Terminal Form	Surface Mount
Package Height	4.22(Max)
Package Length	17.75(Max)
Package Width	9.53(Max)

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
Configuration	Single
Channel Mode	Enhancement
Channel Type	N
Number of Elements per pcs	1
Mode of Operation	Pulsed RF
Process Technology	LDMOS
Maximum Drain Source Voltage (V)	60
Maximum Gate Source Voltage (V)	13
Maximum VSWR	5
Maximum Continuous Drain Current (A)	33
Maximum Drain Source Resistance (mOhm)	135@6.15V
Typical Forward Transconductance (S)	13
Output Power (W)	130(Typ)
Typical Power Gain (dB)	12
Maximum Frequency (MHz)	3100
Minimum Frequency (MHz)	2700
Typical Fall Time (ns)	6
Typical Rise Time (ns)	20
Typical Drain Efficiency (%)	47
Operating Temperature-Min	-65
Operating Temperature-Max	200
Original Package	CDFM
Pin Count	3
Terminal Form	Surface Mount
Package Height	4.22(Max)
Package Length	17.75(Max)
Package Width	9.53(Max)