NT6TL128T64BR-G0

SKU: 126893

Manufacturer: Nanya Technology

DRAM Chip Mobile LPDDR2 SDRAM 8Gbit 128Mx64 1.8V/1.2V 216-Pin POP-FBGA

1260 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	8G
Organization	128Mx64
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	64
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1066
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	500
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	64
Original Package	POP-FBGA
Pin Count	216
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.59(Max)
Package Length	12
Package Width	12
PCB changed	216

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
Automotive	Unknown
PPAP	Unknown
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	8G
Organization	128Mx64
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	64
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1066
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	500
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	64
Original Package	POP-FBGA
Pin Count	216
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.59(Max)
Package Length	12
Package Width	12
PCB changed	216