NT6TL128M32BQ-G0

SKU: 126894

Manufacturer: Nanya Technology

DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 128Mx32 1.2V/1.8V 168-Pin POP-FBGA

1100 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	250
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	POP-FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.48(Max)
Package Length	12
Package Width	12
PCB changed	168

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.36
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	4G
Organization	128Mx32
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	1066
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	250
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	POP-FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.48(Max)
Package Length	12
Package Width	12
PCB changed	168