EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Obsolete |
HTS
|
8542.32.00.02 |
Automotive
|
No |
PPAP
|
No |
DRAM Type
|
RLDRAM |
Chip Density (bit)
|
288M |
Organization
|
8Mx36 |
Number of Internal Banks
|
8 |
Number of Words per Bank
|
1M |
Number of Bits/Word (bit)
|
36 |
Data Bus Width (bit)
|
36 |
Maximum Clock Rate (MHz)
|
400 |
Address Bus Width (bit)
|
22 |
Interface Type
|
HSTL |
Operating Supply Voltage-Min (V)
|
1.7 |
Typical Operating Supply Voltage (V)
|
1.8 |
Operating Supply Voltage-Max (V)
|
1.9 |
Operating Temperature-Min
|
0 |
Operating Temperature-Max
|
95 |
Supplier Temperature Grade
|
Commercial |
Number of I/O Lines (bit)
|
36 |
Packing Method
|
Tray |
Original Package
|
UBGA |
Pin Count
|
144 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
0.7 |
Package Length
|
18.5 |
Package Width
|
11 |
PCB changed
|
144 |