MT49H32M9FM-33

SKU: 84387

Manufacturer: Micron Technology

DRAM Chip RLDRAM 288Mbit 32Mx9 1.8V 144-Pin UBGA Tray

200 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	RLDRAM
Chip Density (bit)	288M
Organization	32Mx9
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	9
Data Bus Width (bit)	9
Maximum Clock Rate (MHz)	300
Address Bus Width (bit)	24
Interface Type	HSTL
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	368
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	9
Packing Method	Tray
Original Package	UBGA
Pin Count	144
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7
Package Length	18.5
Package Width	11
PCB changed	144

Your name

Your email

Enquiry

Products specifications

EU RoHS	Not Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	RLDRAM
Chip Density (bit)	288M
Organization	32Mx9
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	9
Data Bus Width (bit)	9
Maximum Clock Rate (MHz)	300
Address Bus Width (bit)	24
Interface Type	HSTL
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.9
Operating Current (mA)	368
Operating Temperature-Min	0
Operating Temperature-Max	95
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	9
Packing Method	Tray
Original Package	UBGA
Pin Count	144
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7
Package Length	18.5
Package Width	11
PCB changed	144