EDF8164A1MA-GD-F-R

SKU: 39960

Manufacturer: Micron Technology

DRAM Chip Mobile LPDDR3 SDRAM 8Gbit 128Mx64 1.2V/1.8V 253-Pin FBGA T/R

1010 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	8G
Organization	128Mx64
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	64
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	480
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	64
Packing Method	Tape and Reel
Original Package	FBGA
Pin Count	253
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58
Package Length	12.5
Package Width	12.5
PCB changed	253

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR3 SDRAM
Chip Density (bit)	8G
Organization	128Mx64
Number of Internal Banks	8
Number of Words per Bank	16M
Number of Bits/Word (bit)	64
Data Bus Width (bit)	64
Maximum Clock Rate (MHz)	1600
Maximum Access Time (ns)	5.5
Address Bus Width (bit)	17
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	480
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	64
Packing Method	Tape and Reel
Original Package	FBGA
Pin Count	253
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.58
Package Length	12.5
Package Width	12.5
PCB changed	253