EDB8132B4PM-1D-F-D

SKU: 18760

Manufacturer: Micron Technology

DRAM Chip Mobile LPDDR2 SDRAM 8Gbit 256Mx32 1.2V/1.8V 168-Pin FBGA Tray

10 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	533
Address Bus Width (bit)	14
Interface Type	HSUL
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	160
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Packing Method	Tray
Original Package	FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12
PCB changed	168

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8542.32.00.36
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	8G
Organization	256Mx32
Number of Internal Banks	8
Number of Words per Bank	32M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	533
Address Bus Width (bit)	14
Interface Type	HSUL
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.3
Operating Current (mA)	160
Operating Temperature-Min	-30
Operating Temperature-Max	85
Number of I/O Lines (bit)	32
Packing Method	Tray
Original Package	FBGA
Pin Count	168
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.45
Package Length	12
Package Width	12
PCB changed	168