ATV750B-10DM/883

SKU: 30109

Manufacturer: Microchip Technology

CPLD ATV750 Family 10 Macro Cells 71MHz 0.65um, CMOS Technology 5V 24-Pin Windowed CDIP

2410 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
Part Status	Obsolete
HTS	8542.32.00.51
Automotive	No
PPAP	No
Family Name	ATV750
Program Memory Type	EPROM
Number of Macro Cells	10
Process Technology	0.65um, CMOS
Product Terms	16
Data Gate	No
Maximum Number of User I/Os	10
Number of Flip Flops	20
In-System Programmability	No
Programmability	Yes
Reprogrammability Support	Yes
Maximum Internal Frequency (MHz)	90
Maximum Clock to Output Delay (ns)	10
Maximum Propagation Delay Time (ns)	10
Speed Grade	10
Individual Output Enable Control	No
Operating Supply Voltage-Min (V)	4.5
Operating Supply Voltage-Max (V)	5.5
Typical Operating Supply Voltage (V)	5
Operating Temperature-Min	-55
Operating Temperature-Max	125
Supplier Temperature Grade	Military
Tradename	ATV750
Original Package	Windowed CDIP
Pin Count	24
Standard Package Method	DIP
Terminal Form	Through Hole
Package Height	3.56(Max)
Package Length	32.5(Max)
Package Width	7.87(Max)
PCB changed	24

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Products specifications

EU RoHS	Not Compliant
Part Status	Obsolete
HTS	8542.32.00.51
Automotive	No
PPAP	No
Family Name	ATV750
Program Memory Type	EPROM
Number of Macro Cells	10
Process Technology	0.65um, CMOS
Product Terms	16
Data Gate	No
Maximum Number of User I/Os	10
Number of Flip Flops	20
In-System Programmability	No
Programmability	Yes
Reprogrammability Support	Yes
Maximum Internal Frequency (MHz)	90
Maximum Clock to Output Delay (ns)	10
Maximum Propagation Delay Time (ns)	10
Speed Grade	10
Individual Output Enable Control	No
Operating Supply Voltage-Min (V)	4.5
Operating Supply Voltage-Max (V)	5.5
Typical Operating Supply Voltage (V)	5
Operating Temperature-Min	-55
Operating Temperature-Max	125
Supplier Temperature Grade	Military
Tradename	ATV750
Original Package	Windowed CDIP
Pin Count	24
Standard Package Method	DIP
Terminal Form	Through Hole
Package Height	3.56(Max)
Package Length	32.5(Max)
Package Width	7.87(Max)
PCB changed	24