EU RoHS
|
Not Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Family Name
|
Fusion® |
Process Technology
|
130nm |
User I/Os
|
119 |
Number of I/O Banks
|
5 |
Number of Inter Dielectric Layers
|
7 |
Number of Registers
|
38400 |
Operating Supply Voltage (V)
|
1.5 |
Device System Gates
|
1500000 |
Program Memory Type
|
FLASH |
Embedded Memory (Kbit)
|
270 |
Total Number of Block RAM
|
60 |
Device Logic Gates
|
1500000 |
Number of Global Clocks
|
18 |
Device Number of DLLs/PLLs
|
2 |
Programmability
|
Yes |
Reprogrammability Support
|
Yes |
Copy Protection
|
No |
Opr. Frequency (MHz)
|
1470.59 |
In-System Programmability
|
Yes |
Speed Grade
|
2 |
Maximum I/O Performance
|
700Mbps |
Operating Supply Voltage-Min (V)
|
1.425 |
Operating Supply Voltage-Max (V)
|
1.575 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Industrial |
Packing Method
|
Tray |
Tradename
|
Fusion® |
Original Package
|
FBGA |
Pin Count
|
256 |
Standard Package Method
|
BGA |
Terminal Form
|
Surface Mount |
Package Height
|
1.2 |
Package Length
|
17 |
Package Width
|
17 |
PCB changed
|
256 |