|
EU RoHS
|
Compliant |
|
ECCN (US)
|
EAR99 |
|
Part Status
|
Active |
|
Automotive
|
No |
|
PPAP
|
No |
|
Type
|
SPI |
|
Process Technology
|
BiCMOS |
|
Number of Channels per Chip
|
4 |
|
Maximum Data Rate
|
150Mbps |
|
Maximum Rise Time (ns)
|
2 |
|
Maximum Fall Time (ns)
|
2 |
|
Minimum Pulse Width (ns)
|
40 |
|
Maximum Pulse Width Distortion (ns)
|
4.7 |
|
Output Type
|
CMOS |
|
Operating Supply Voltage-Max (V)
|
5.5 |
|
Operating Supply Voltage-Min (V)
|
1.71 |
|
Minimum Isolation Voltage (Vrms)
|
2750 |
|
Maximum Propagation Delay Time (tPHL) (ns)
|
60.2 |
|
Maximum Propagation Delay Time (tPLH) (ns)
|
58.4 |
|
Maximum Working Insulation Voltage
|
443Vrms |
|
Maximum Power Dissipation (mW)
|
1066.7 |
|
Operating Temperature-Min
|
-40 |
|
Operating Temperature-Max
|
125 |
|
Forward/Reverse Channels
|
4/0 |
|
Minimum Common Mode Rejection (kV/us)
|
25(Typ) |
|
Coupling Type
|
Capacitive Coupling |
|
Standard Package Method
|
SOP |
|
Original Package
|
SOIC N |
|
Pin Count
|
16 |
|
Terminal Form
|
Surface Mount |
|
Package Height
|
1.37 |
|
Package Length
|
9.9 |
|
Package Width
|
3.9 |
|
PCB changed
|
16 |