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THGBMNG5D1LBAIL KIOXIA Corporation

THGBMNG5D1LBAIL

SKU: 130143

Manufacturer: KIOXIA Corporation

MLC NAND Flash Serial e-MMC 32G-bit 153-Pin FBGA Tray

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8740 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

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Specifications
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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	Active
HTS	8542.32.00.51
Automotive	Unknown
PPAP	Unknown
Cell Type	MLC NAND
Chip Density (bit)	32G
Architecture	Sectored
Boot Block	No
Block Organization	Symmetrical
Programmability	Yes
Timing Type	Synchronous
Process Technology	15nm
Interface Type	Serial e-MMC
Operating Temperature-Min	-25
Operating Temperature-Max	85
Command Compatible	Yes
ECC Support	No
Support of Page Mode	No
Packing Method	Tray
Original Package	FBGA
Pin Count	153
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13
Package Width	11.5
PCB changed	153

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991.b.1.a
Part Status	Active
HTS	8542.32.00.51
Automotive	Unknown
PPAP	Unknown
Cell Type	MLC NAND
Chip Density (bit)	32G
Architecture	Sectored
Boot Block	No
Block Organization	Symmetrical
Programmability	Yes
Timing Type	Synchronous
Process Technology	15nm
Interface Type	Serial e-MMC
Operating Temperature-Min	-25
Operating Temperature-Max	85
Command Compatible	Yes
ECC Support	No
Support of Page Mode	No
Packing Method	Tray
Original Package	FBGA
Pin Count	153
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Length	13
Package Width	11.5
PCB changed	153