CY7C1380F-167BZI

SKU: 143489

Manufacturer: Intel

SRAM Chip Sync Quad 3.3V 18M-bit 512K x 36 3.4ns 165-Pin FBGA Tray

2940 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991
Part Status	Obsolete
HTS	8542.32.00.41
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	19
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	275
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991
Part Status	Obsolete
HTS	8542.32.00.41
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	19
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	275
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165