CY7C1380KV33-167AXC

SKU: 44473

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Quad 3.3V 18M-bit 512K x 36 3.4ns 100-Pin TQFP Tray

20 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.2.b.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	3
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	65nm, CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	163
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	TQFP
Pin Count	100
Standard Package Method	QFP
Terminal Form	Surface Mount
Package Height	1.4
Package Length	20
Package Width	14
PCB changed	100

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.2.b.
Part Status	Active
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	3
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Process Technology	65nm, CMOS
Operating Supply Voltage-Min (V)	3.135
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	163
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	TQFP
Pin Count	100
Standard Package Method	QFP
Terminal Form	Surface Mount
Package Height	1.4
Package Length	20
Package Width	14
PCB changed	100