IS43LR16800E-6BL

SKU: 33232

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip Mobile-DDR SDRAM 128Mbit 8Mx16 1.8V 60-Pin TFBGA

2290 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	128M
Organization	8Mx16
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	8
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	10
Package Width	8
PCB changed	60

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	128M
Organization	8Mx16
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	8
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	90
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	10
Package Width	8
PCB changed	60