IS43LR16160F-6BLI

SKU: 108136

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip Mobile-DDR SDRAM 256Mbit 16Mx16 1.8V 60-Pin TFBGA

1710 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	8
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	80
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	10
Package Width	8
PCB changed	60

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
Automotive	No
PPAP	No
DRAM Type	Mobile-DDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	8
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	80
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	60
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	10
Package Width	8
PCB changed	60