IS43LD32320C-25BLI

SKU: 108135

Manufacturer: Integrated Silicon Solution Inc

DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V/1.8V 134-Pin TFBGA

4170 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.32
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	1G
Organization	32Mx32
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	800
Maximum Access Time (ns)	10
Address Bus Width (bit)	12
Process Technology	CMOS
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	200
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	11.5
Package Width	10
PCB changed	134

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.32
Automotive	No
PPAP	No
DRAM Type	Mobile LPDDR2 SDRAM
Chip Density (bit)	1G
Organization	32Mx32
Number of Internal Banks	8
Number of Words per Bank	4M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	800
Maximum Access Time (ns)	10
Address Bus Width (bit)	12
Process Technology	CMOS
Interface Type	HSUL_12
Operating Supply Voltage-Min (V)	1.14
Typical Operating Supply Voltage (V)	1.2
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	200
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	134
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.7(Max)
Package Length	11.5
Package Width	10
PCB changed	134