EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
Automotive
|
No |
PPAP
|
No |
Product Category
|
Power MOSFET |
Body Material
|
GaN |
Configuration
|
Single |
Channel Mode
|
Enhancement |
Channel Type
|
N |
Number of Elements per pcs
|
1 |
Maximum Drain Source Voltage (V)
|
200 |
Maximum Gate Source Voltage (V)
|
6 |
Maximum Gate Threshold Voltage (V)
|
2.5 |
Operating Junction Temperature (°C)
|
-40 to 150 |
Maximum Continuous Drain Current (A)
|
5 |
Maximum Gate Source Leakage Current (nA)
|
50000 |
Maximum IDSS (uA)
|
50 |
Maximum Drain Source Resistance (mOhm)
|
100@5V |
Typical Gate Charge @ Vgs (nC)
|
1@5V |
Typical Gate to Drain Charge (nC)
|
0.2 |
Typical Gate to Source Charge (nC)
|
0.3 |
Typical Reverse Recovery Charge (nC)
|
0 |
Typical Input Capacitance @ Vds (pF)
|
100@100V |
Typical Reverse Transfer Capacitance @ Vds (pF)
|
0.4@100V |
Minimum Gate Threshold Voltage (V)
|
0.8 |
Typical Output Capacitance (pF)
|
64 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
150 |
Packing Method
|
Tape and Reel |
Maximum Positive Gate Source Voltage (V)
|
6 |
Maximum Pulsed Drain Current @ TC=25°C (A)
|
22 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
|
85 |
Typical Gate Plateau Voltage (V)
|
2.3 |
Typical Gate Threshold Voltage (V)
|
1.4 |
Original Package
|
Die |
Pin Count
|
4 |
Standard Package Method
|
Die |
Terminal Form
|
Surface Mount |
Package Height
|
0.69 |
Package Length
|
1.71 |
Package Width
|
0.92 |