EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8541.21.00.95 |
Automotive
|
Yes |
PPAP
|
Yes |
Product Category
|
Small Signal |
Configuration
|
Single |
Channel Mode
|
Enhancement |
Channel Type
|
N |
Number of Elements per pcs
|
1 |
Maximum Drain Source Voltage (V)
|
60 |
Maximum Gate Source Voltage (V)
|
±20 |
Maximum Gate Threshold Voltage (V)
|
2.5 |
Operating Junction Temperature (°C)
|
-55 to 150 |
Maximum Continuous Drain Current (A)
|
0.21 |
Maximum Gate Source Leakage Current (nA)
|
10 |
Maximum IDSS (uA)
|
1 |
Maximum Drain Source Resistance (mOhm)
|
5000@10V |
Typical Gate Charge @ Vgs (nC)
|
0.223@4.5V |
Typical Gate to Drain Charge (nC)
|
0.178 |
Typical Gate to Source Charge (nC)
|
0.082 |
Typical Input Capacitance @ Vds (pF)
|
22@25V |
Typical Reverse Transfer Capacitance @ Vds (pF)
|
2@25V |
Minimum Gate Threshold Voltage (V)
|
1 |
Typical Output Capacitance (pF)
|
11 |
Maximum Power Dissipation (mW)
|
540 |
Typical Fall Time (ns)
|
5.6 |
Typical Rise Time (ns)
|
3 |
Typical Turn-Off Delay Time (ns)
|
7.6 |
Typical Turn-On Delay Time (ns)
|
2.8 |
Operating Temperature-Min
|
-55 |
Operating Temperature-Max
|
150 |
Supplier Temperature Grade
|
Automotive |
Packing Method
|
Tape and Reel |
Maximum Power Dissipation on PCB @ TC=25°C (W)
|
0.54 |
Maximum Pulsed Drain Current @ TC=25°C (A)
|
0.8 |
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
|
348 |
Typical Diode Forward Voltage (V)
|
0.78 |
Maximum Diode Forward Voltage (V)
|
1.5 |
Maximum Positive Gate Source Voltage (V)
|
20 |
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
|
0.21 |
Original Package
|
SOT-23 |
Pin Count
|
3 |
Standard Package Method
|
SOT-23 |
Terminal Form
|
Surface Mount |
Package Height
|
0.98 |
Package Length
|
2.9 |
Package Width
|
1.3 |
PCB changed
|
3 |