S25FL128SAGMFI003

SKU: 134472

Manufacturer: Cypress - An Infineon Technologies Company

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 128M-bit 128M/64M/32M x 1/2-bit/4-bit 14.5ns 16-Pin SOIC W T/R

7780 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Active
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	128M
Architecture	Sectored
Boot Block	Yes
Block Organization	Symmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	32
Sector Size	64Kbyte x 256
Page Size	256byte
Number of Bits/Word (bit)	1/2/4
Number of Words	128M/64M/32M
Programmability	Yes
Timing Type	Synchronous
Max. Access Time (ns)	14.5
Maximum Erase Time (s)	165/Bulk
Maximum Programming Time (ms)	0.75/Page
Process Technology	65nm, MirrorBit
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Frequency (MHz)	133
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	100
Program Current (mA)	100
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	No
Minimum Endurance (Cycles)	100000
Packing Method	Tape and Reel
Pin Count	16
Standard Package Method	SOP
Original Package	SOIC W
Terminal Form	Surface Mount
Package Height	2.55(Max)
Package Length	10.3
Package Width	7.5
PCB changed	16

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Active
HTS	8542.32.00.71
Automotive	No
PPAP	No
Cell Type	NOR
Chip Density (bit)	128M
Architecture	Sectored
Boot Block	Yes
Block Organization	Symmetrical
Location of Boot Block	Bottom
Address Bus Width (bit)	32
Sector Size	64Kbyte x 256
Page Size	256byte
Number of Bits/Word (bit)	1/2/4
Number of Words	128M/64M/32M
Programmability	Yes
Timing Type	Synchronous
Max. Access Time (ns)	14.5
Maximum Erase Time (s)	165/Bulk
Maximum Programming Time (ms)	0.75/Page
Process Technology	65nm, MirrorBit
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Frequency (MHz)	133
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3
Operating Supply Voltage-Max (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	100
Program Current (mA)	100
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	Yes
Support of Page Mode	No
Minimum Endurance (Cycles)	100000
Packing Method	Tape and Reel
Pin Count	16
Standard Package Method	SOP
Original Package	SOIC W
Terminal Form	Surface Mount
Package Height	2.55(Max)
Package Length	10.3
Package Width	7.5
PCB changed	16