CY7C1370DV25-167BZC

SKU: 46819

Manufacturer: Cypress - An Infineon Technologies Company

SRAM Chip Sync Quad 2.5V 18M-bit 512K x 36 3.4ns 165-Pin FBGA Tray

120 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	19
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Operating Supply Voltage-Min (V)	2.375
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.625
Operating Current (mA)	275
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165

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Products specifications

EU RoHS	Not Compliant
ECCN (US)	3A991.b.2.a
Part Status	Obsolete
HTS	8542.32.00.41
Automotive	No
PPAP	No
Chip Density (bit)	18M
Number of Words	512K
Number of Bits/Word (bit)	36
Architecture	Pipelined
Data Rate Architecture	SDR
Address Bus Width (bit)	19
Number of Ports	4
Timing Type	Synchronous
Max. Access Time (ns)	3.4
Maximum Clock Rate (MHz)	167
Operating Supply Voltage-Min (V)	2.375
Typical Operating Supply Voltage (V)	2.5
Operating Supply Voltage-Max (V)	2.625
Operating Current (mA)	275
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Packing Method	Tray
Original Package	FBGA
Pin Count	165
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.89
Package Length	15
Package Width	13
PCB changed	165