HCPL-090J-500E

SKU: 68537

Manufacturer: Broadcom Inc

Digital Isolator CMOS 4-CH 110MBd 16-Pin SOIC N T/R

170 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.40.80.00
Automotive	No
PPAP	No
Type	General Purpose
Number of Channels per Chip	4
Maximum Data Rate	110MBd(Typ)
Maximum Rise Time (ns)	4
Maximum Fall Time (ns)	4
Minimum Pulse Width (ns)	10
Maximum Pulse Width Distortion (ns)	3
Maximum Propagation Delay Skew (ns)	6
Output Type	CMOS
Operating Supply Voltage-Max (V)	5.5
Operating Supply Voltage-Min (V)	3
Maximum Propagation Delay Time (tPHL) (ns)	18
Minimum Isolation Voltage (Vrms)	2500
Maximum Propagation Delay Time (tPLH) (ns)	18
Maximum Working Insulation Voltage	150Vrms
Maximum Quiescent Supply Current (mA)	0.036/12
Maximum Output Current Drive (mA)	10
Maximum Power Dissipation (mW)	150
Operating Temperature-Min	-40
Operating Temperature-Max	100
Packing Method	Tape and Reel
Forward/Reverse Channels	4/0
Minimum Common Mode Rejection (kV/us)	15
Maximum ESD Protection Voltage (kV)	2@HBM
Coupling Type	Magnetic Coupling
Standard Package Method	SOP
Original Package	SOIC N
Pin Count	16
Terminal Form	Surface Mount
Package Height	1.52(Max)
Package Length	9.99(Max)
Package Width	3.98(Max)
PCB changed	16

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.40.80.00
Automotive	No
PPAP	No
Type	General Purpose
Number of Channels per Chip	4
Maximum Data Rate	110MBd(Typ)
Maximum Rise Time (ns)	4
Maximum Fall Time (ns)	4
Minimum Pulse Width (ns)	10
Maximum Pulse Width Distortion (ns)	3
Maximum Propagation Delay Skew (ns)	6
Output Type	CMOS
Operating Supply Voltage-Max (V)	5.5
Operating Supply Voltage-Min (V)	3
Maximum Propagation Delay Time (tPHL) (ns)	18
Minimum Isolation Voltage (Vrms)	2500
Maximum Propagation Delay Time (tPLH) (ns)	18
Maximum Working Insulation Voltage	150Vrms
Maximum Quiescent Supply Current (mA)	0.036/12
Maximum Output Current Drive (mA)	10
Maximum Power Dissipation (mW)	150
Operating Temperature-Min	-40
Operating Temperature-Max	100
Packing Method	Tape and Reel
Forward/Reverse Channels	4/0
Minimum Common Mode Rejection (kV/us)	15
Maximum ESD Protection Voltage (kV)	2@HBM
Coupling Type	Magnetic Coupling
Standard Package Method	SOP
Original Package	SOIC N
Pin Count	16
Terminal Form	Surface Mount
Package Height	1.52(Max)
Package Length	9.99(Max)
Package Width	3.98(Max)
PCB changed	16