EU RoHS
|
Not Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
SVHC
|
Yes |
SVHC Exceeds Threshold
|
Yes |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
1 |
Process Technology
|
BiCOM |
Maximum Input Offset Voltage (mV)
|
2@±15V |
Minimum Dual Supply Voltage (V)
|
±5 |
Typical Dual Supply Voltage (V)
|
±15 |
Maximum Dual Supply Voltage (V)
|
±18 |
Maximum Input Offset Current (uA)
|
0.4@±15V |
Maximum Input Bias Current (uA)
|
8@±15V |
Typical Output Current (mA)
|
50(Min) |
Power Supply Type
|
Dual |
Maximum Power Dissipation (mW)
|
1300 |
Typical Slew Rate (V/us)
|
300@±15V |
Typical Input Noise Voltage Density (nV/rtHz)
|
15@±15V |
Typical Voltage Gain (dB)
|
93.06 |
Minimum PSRR (dB)
|
86 |
Minimum CMRR (dB)
|
86 |
Minimum CMRR Range (dB)
|
85 to 90 |
Typical Gain Bandwidth Product (MHz)
|
40 |
Typical Settling Time (ns)
|
110 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-55 |
Operating Temperature-Max
|
125 |
Packing Method
|
Tube |
Original Package
|
CDIP |
Pin Count
|
14 |
Standard Package Method
|
DIP |
Terminal Form
|
Through Hole |
Package Height
|
3.56(Max) |
Package Length
|
19.94(Max) |
Package Width
|
7.87(Max) |
PCB changed
|
14 |