EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.33.00.01 |
Automotive
|
No |
PPAP
|
No |
Type
|
High Speed Amplifier |
Manufacturer Type
|
High Speed Amplifier |
Number of Channels per Chip
|
2 |
Rail to Rail
|
Rail to Rail Input/Output |
Process Technology
|
BiCOM |
Maximum Input Offset Voltage (mV)
|
0.9@5V |
Minimum Single Supply Voltage (V)
|
2.7 |
Typical Single Supply Voltage (V)
|
3 |
Maximum Single Supply Voltage (V)
|
12 |
Minimum Dual Supply Voltage (V)
|
±1.35 |
Typical Dual Supply Voltage (V)
|
±5 |
Maximum Dual Supply Voltage (V)
|
±6 |
Maximum Input Offset Current (uA)
|
0.9@5V |
Typical Input Bias Current (uA)
|
4@5V |
Maximum Input Bias Current (uA)
|
6@5V |
Maximum Quiescent Current (mA)
|
17@5V |
Power Supply Type
|
Single |
Typical Slew Rate (V/us)
|
100@5V |
Typical Input Noise Voltage Density (nV/rtHz)
|
4.3@5V |
Typical Voltage Gain (dB)
|
105 |
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
1.6@5V |
Minimum PSRR (dB)
|
90 |
Minimum CMRR (dB)
|
90 |
Minimum CMRR Range (dB)
|
90 to 95 |
Typical Gain Bandwidth Product (MHz)
|
190 |
Typical Settling Time (ns)
|
40 |
Shut Down Support
|
No |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
125 |
Supplier Temperature Grade
|
Extended |
Packing Method
|
Tape and Reel |
Pin Count
|
8 |
Standard Package Method
|
SOP |
Original Package
|
SOIC N |
Terminal Form
|
Surface Mount |
Package Height
|
1.5(Max) |
Package Length
|
5(Max) |
Package Width
|
4(Max) |
PCB changed
|
8 |