W988D6FBGX6E

SKU: 157096

Manufacturer: Winbond Electronics

DRAM Chip Mobile LPSDR SDRAM 256Mbit 16Mx16 1.8V 54-Pin VFBGA

1560 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile LPSDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	5.4
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	75
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.66
Package Length	9
Package Width	8
PCB changed	54

Your name

Your email

Enquiry

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	Mobile LPSDR SDRAM
Chip Density (bit)	256M
Organization	16Mx16
Number of Internal Banks	4
Number of Words per Bank	4M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	5.4
Address Bus Width (bit)	15
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	75
Operating Temperature-Min	-25
Operating Temperature-Max	85
Supplier Temperature Grade	Extended
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.66
Package Length	9
Package Width	8
PCB changed	54