W987D6HBGX6I

SKU: 157095

Manufacturer: Winbond Electronics

DRAM Chip Mobile LPSDR SDRAM 128Mbit 8Mx16 1.8V 54-Pin VFBGA

3400 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPSDR SDRAM
Chip Density (bit)	128M
Organization	8Mx16
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	75
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.66
Package Length	9
Package Width	8
PCB changed	54

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	Mobile LPSDR SDRAM
Chip Density (bit)	128M
Organization	8Mx16
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	14
Interface Type	LVCMOS
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	75
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	VFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.66
Package Length	9
Package Width	8
PCB changed	54