W9864G6JT-6I

SKU: 17216

Manufacturer: Winbond Electronics

DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TFBGA

2090 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	SDRAM
Chip Density (bit)	64M
Organization	4Mx16
Number of Internal Banks	4
Number of Words per Bank	1M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	14
Interface Type	LVTTL
Operating Supply Voltage-Min (V)	3
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	75
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	8
Package Width	8
PCB changed	54

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	NRND
HTS	8542.32.00.02
Automotive	No
PPAP	No
DRAM Type	SDRAM
Chip Density (bit)	64M
Organization	4Mx16
Number of Internal Banks	4
Number of Words per Bank	1M
Number of Bits/Word (bit)	16
Data Bus Width (bit)	16
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	14
Interface Type	LVTTL
Operating Supply Voltage-Min (V)	3
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	75
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Number of I/O Lines (bit)	16
Original Package	TFBGA
Pin Count	54
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	8
Package Width	8
PCB changed	54