W9825G2JB-6

SKU: 31315

Manufacturer: Winbond Electronics

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA

2100 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	SDRAM
Chip Density (bit)	256M
Organization	8Mx32
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	12
Interface Type	LVTTL
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	150
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	90

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8542.32.00.24
Automotive	No
PPAP	No
DRAM Type	SDRAM
Chip Density (bit)	256M
Organization	8Mx32
Number of Internal Banks	4
Number of Words per Bank	2M
Number of Bits/Word (bit)	32
Data Bus Width (bit)	32
Maximum Clock Rate (MHz)	166
Maximum Access Time (ns)	6
Address Bus Width (bit)	12
Interface Type	LVTTL
Operating Supply Voltage-Min (V)	2.7
Typical Operating Supply Voltage (V)	3.3
Operating Supply Voltage-Max (V)	3.6
Operating Current (mA)	150
Operating Temperature-Min	0
Operating Temperature-Max	70
Supplier Temperature Grade	Commercial
Number of I/O Lines (bit)	32
Original Package	TFBGA
Pin Count	90
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.8(Max)
Package Length	13
Package Width	8
PCB changed	90