W29N04GZBIBA

SKU: 150000

Manufacturer: Winbond Electronics

NAND Flash Parallel 1.8V 4G-bit 512M x 8 Automotive 63-Pin VFBGA Tray

2690 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Active
HTS	8542.32.00.51
Automotive	Yes
PPAP	Unknown
Cell Type	NAND
Chip Density (bit)	4G
Boot Block	No
Address Bus Width (bit)	30
Page Size	2Kbyte
Number of Bits/Word (bit)	8
Number of Words	512M
Programmability	Yes
Timing Type	Asynchronous
Maximum Erase Time (s)	0.01/Block
Maximum Programming Time (ms)	0.7/Page
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	20
Program Current (mA)	20
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	No
ECC Support	Yes
Support of Page Mode	No
Minimum Endurance (Cycles)	100000
Packing Method	Tray
Original Package	VFBGA
Pin Count	63
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.6(Max)
Package Length	11
Package Width	9
PCB changed	63

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Products specifications

EU RoHS	Compliant
ECCN (US)	3A991b.1.a.
Part Status	Active
HTS	8542.32.00.51
Automotive	Yes
PPAP	Unknown
Cell Type	NAND
Chip Density (bit)	4G
Boot Block	No
Address Bus Width (bit)	30
Page Size	2Kbyte
Number of Bits/Word (bit)	8
Number of Words	512M
Programmability	Yes
Timing Type	Asynchronous
Maximum Erase Time (s)	0.01/Block
Maximum Programming Time (ms)	0.7/Page
Interface Type	Parallel
Operating Supply Voltage-Min (V)	1.7
Typical Operating Supply Voltage (V)	1.8
Operating Supply Voltage-Max (V)	1.95
Operating Current (mA)	20
Program Current (mA)	20
Operating Temperature-Min	-40
Operating Temperature-Max	85
Supplier Temperature Grade	Industrial
Command Compatible	No
ECC Support	Yes
Support of Page Mode	No
Minimum Endurance (Cycles)	100000
Packing Method	Tray
Original Package	VFBGA
Pin Count	63
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.6(Max)
Package Length	11
Package Width	9
PCB changed	63