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SDIN7DU2-32G
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SDIN7DU2-64G
SDIN7DU2-32G
SKU:
38054
Manufacturer:
Western Digital
Managed NAND Flash Serial e-MMC 3.3V 256G-bit 256G/64G/32G x 1/4-bit/8-bit 153-Pin TFBGA Tray
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10 parts IN STOCK
Shipped from :
Netherlands
Expected Ships :
Rohs State :
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Products specifications
EU RoHS
Supplier Unconfirmed
ECCN (US)
3A991.b.1.a
Part Status
Obsolete
HTS
8542.32.00.71
Cell Type
Managed NAND
Chip Density (bit)
256G
Architecture
Sectored
Number of Bits/Word (bit)
1/4/8
Number of Words
256G/64G/32G
Programmability
Yes
Timing Type
Synchronous
Interface Type
Serial e-MMC
Operating Supply Voltage-Min (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Operating Supply Voltage-Max (V)
3.6
Operating Temperature-Min
-25
Operating Temperature-Max
85
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
No
Packing Method
Tray
Original Package
TFBGA
Pin Count
153
Standard Package Method
BGA
Terminal Form
Surface Mount
Package Height
0.93(Max)
Package Length
13
Package Width
11.5
PCB changed
153
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SDIN7DU2-32G
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SDIN7DU2-32G
In Stock
SDIN7DU2-32G
Distributor
SDIN7DU2-32G
Flash
SDIN7DU2-32G
Western Digital
Products specifications
EU RoHS
Supplier Unconfirmed
ECCN (US)
3A991.b.1.a
Part Status
Obsolete
HTS
8542.32.00.71
Cell Type
Managed NAND
Chip Density (bit)
256G
Architecture
Sectored
Number of Bits/Word (bit)
1/4/8
Number of Words
256G/64G/32G
Programmability
Yes
Timing Type
Synchronous
Interface Type
Serial e-MMC
Operating Supply Voltage-Min (V)
2.7
Typical Operating Supply Voltage (V)
3.3
Operating Supply Voltage-Max (V)
3.6
Operating Temperature-Min
-25
Operating Temperature-Max
85
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
No
Packing Method
Tray
Original Package
TFBGA
Pin Count
153
Standard Package Method
BGA
Terminal Form
Surface Mount
Package Height
0.93(Max)
Package Length
13
Package Width
11.5
PCB changed
153