SI8901EDB-T2-E1

SKU: 148821

Manufacturer: Vishay

Trans MOSFET P-CH Si 20V 3.5A 6-Pin Micro Foot T/R

930 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Body Material	Si
Process Technology	TrenchFET
Configuration	Dual Common Drain
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	2
Maximum Drain Source Voltage (V)	20
Maximum Gate Source Voltage (V)	±12
Maximum Continuous Drain Current (A)	3.5
Maximum Drain Source Resistance (mOhm)	60@4.5V
Maximum Power Dissipation (mW)	1700
Typical Fall Time (ns)	9000
Typical Rise Time (ns)	2200
Typical Turn-Off Delay Time (ns)	1300
Typical Turn-On Delay Time (ns)	2300
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Original Package	Micro Foot
Pin Count	6
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.36(Max)
Package Length	2.4(Max)
Package Width	1.6(Max)

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Obsolete
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Body Material	Si
Process Technology	TrenchFET
Configuration	Dual Common Drain
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	2
Maximum Drain Source Voltage (V)	20
Maximum Gate Source Voltage (V)	±12
Maximum Continuous Drain Current (A)	3.5
Maximum Drain Source Resistance (mOhm)	60@4.5V
Maximum Power Dissipation (mW)	1700
Typical Fall Time (ns)	9000
Typical Rise Time (ns)	2200
Typical Turn-Off Delay Time (ns)	1300
Typical Turn-On Delay Time (ns)	2300
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Original Package	Micro Foot
Pin Count	6
Standard Package Method	BGA
Terminal Form	Surface Mount
Package Height	0.36(Max)
Package Length	2.4(Max)
Package Width	1.6(Max)