SI6423DQ-T1-GE3

SKU: 94521

Manufacturer: Vishay

Trans MOSFET P-CH 12V 8.2A 8-Pin TSSOP T/R

820 parts IN STOCK

Shipped from :

Netherlands

Expected Ships :

Rohs State : Need to verify

Increments of 0 pcs

Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Configuration	Single Triple Drain Quad Source
Process Technology	TrenchFET
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	12
Maximum Gate Source Voltage (V)	±8
Maximum Gate Threshold Voltage (V)	0.8
Operating Junction Temperature (°C)	-55 to 150
Maximum Continuous Drain Current (A)	8.2
Maximum Gate Source Leakage Current (nA)	100
Maximum IDSS (uA)	1
Maximum Drain Source Resistance (mOhm)	8.5@4.5V
Typical Gate Charge @ Vgs (nC)	74@5V
Typical Gate to Drain Charge (nC)	19
Typical Gate to Source Charge (nC)	9
Minimum Gate Threshold Voltage (V)	0.4
Typical Output Capacitance (pF)	1599
Maximum Power Dissipation (mW)	1500
Typical Fall Time (ns)	200
Typical Rise Time (ns)	75
Typical Turn-Off Delay Time (ns)	270
Typical Turn-On Delay Time (ns)	50
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Maximum Power Dissipation on PCB @ TC=25°C (W)	1.5
Maximum Pulsed Drain Current @ TC=25°C (A)	30
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)	120
Typical Diode Forward Voltage (V)	0.58
Typical Gate Plateau Voltage (V)	1.6
Typical Reverse Recovery Time (ns)	160
Maximum Diode Forward Voltage (V)	1.1
Maximum Positive Gate Source Voltage (V)	8
Maximum Continuous Drain Current on PCB @ TC=25°C (A)	9.5
Original Package	TSSOP
Pin Count	8
Standard Package Method	SOP
Terminal Form	Surface Mount
Package Height	1
Package Length	3
Package Width	4.4
PCB changed	8

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Products specifications

EU RoHS	Compliant
ECCN (US)	EAR99
Part Status	Active
HTS	8541.29.00.95
Automotive	No
PPAP	No
Product Category	Power MOSFET
Configuration	Single Triple Drain Quad Source
Process Technology	TrenchFET
Channel Mode	Enhancement
Channel Type	P
Number of Elements per pcs	1
Maximum Drain Source Voltage (V)	12
Maximum Gate Source Voltage (V)	±8
Maximum Gate Threshold Voltage (V)	0.8
Operating Junction Temperature (°C)	-55 to 150
Maximum Continuous Drain Current (A)	8.2
Maximum Gate Source Leakage Current (nA)	100
Maximum IDSS (uA)	1
Maximum Drain Source Resistance (mOhm)	8.5@4.5V
Typical Gate Charge @ Vgs (nC)	74@5V
Typical Gate to Drain Charge (nC)	19
Typical Gate to Source Charge (nC)	9
Minimum Gate Threshold Voltage (V)	0.4
Typical Output Capacitance (pF)	1599
Maximum Power Dissipation (mW)	1500
Typical Fall Time (ns)	200
Typical Rise Time (ns)	75
Typical Turn-Off Delay Time (ns)	270
Typical Turn-On Delay Time (ns)	50
Operating Temperature-Min	-55
Operating Temperature-Max	150
Packing Method	Tape and Reel
Maximum Power Dissipation on PCB @ TC=25°C (W)	1.5
Maximum Pulsed Drain Current @ TC=25°C (A)	30
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)	120
Typical Diode Forward Voltage (V)	0.58
Typical Gate Plateau Voltage (V)	1.6
Typical Reverse Recovery Time (ns)	160
Maximum Diode Forward Voltage (V)	1.1
Maximum Positive Gate Source Voltage (V)	8
Maximum Continuous Drain Current on PCB @ TC=25°C (A)	9.5
Original Package	TSSOP
Pin Count	8
Standard Package Method	SOP
Terminal Form	Surface Mount
Package Height	1
Package Length	3
Package Width	4.4
PCB changed	8