EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Logic Family
|
LCX |
Logic Function
|
Buffer/Line Driver |
Number of Elements per pcs
|
1 |
Number of Channels per Chip
|
8 |
Number of Inputs per Chip
|
8 |
Number of Input Enables per Chip
|
0 |
Number of Outputs per Chip
|
8 |
Number of Output Enables per Chip
|
2 Low |
Bus Hold
|
No |
Polarity
|
Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns)
|
6.5@3.3V |
Absolute Propagation Delay Time (ns)
|
34 |
Process Technology
|
CMOS |
Input Signal Type
|
Single-Ended |
Output Type
|
3-State |
Maximum Low Level Output Current (mA)
|
24 |
Maximum High Level Output Current (mA)
|
-24 |
Operating Supply Voltage-Min (V)
|
1.65 |
Typical Operating Supply Voltage (V)
|
3.3 |
Operating Supply Voltage-Max (V)
|
3.6 |
Tolerant I/Os (V)
|
5 |
Maximum Quiescent Current (uA)
|
10 |
Propagation Delay Test Condition (pF)
|
50 |
Maximum Power Dissipation (mW)
|
180 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Packing Method
|
Tape and Reel |
Standard Package Method
|
SOP |
Original Package
|
TSSOP-B |
Pin Count
|
20 |
Terminal Form
|
Surface Mount |
Package Height
|
1 |
Package Width
|
4.4 |
PCB changed
|
20 |