EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Logic Family
|
HCT |
Logic Function
|
Buffer/Line Driver |
Number of Elements per pcs
|
2 |
Number of Channels per Chip
|
8 |
Number of Inputs per Chip
|
8 |
Number of Input Enables per Chip
|
0 |
Number of Outputs per Chip
|
8 |
Number of Output Enables per Chip
|
2 Low |
Bus Hold
|
No |
Polarity
|
Inverting |
Maximum Propagation Delay Time @ Maximum CL (ns)
|
30@4.5V |
Absolute Propagation Delay Time (ns)
|
38 |
Process Technology
|
CMOS |
Input Signal Type
|
Single-Ended |
Output Type
|
3-State |
Maximum Low Level Output Current (mA)
|
6 |
Maximum High Level Output Current (mA)
|
-6 |
Operating Supply Voltage-Min (V)
|
4.5 |
Typical Operating Supply Voltage (V)
|
5 |
Operating Supply Voltage-Max (V)
|
5.5 |
Maximum Quiescent Current (uA)
|
8 |
Propagation Delay Test Condition (pF)
|
150 |
Maximum Power Dissipation (mW)
|
500 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Packing Method
|
Tape and Reel |
Standard Package Method
|
SOP |
Original Package
|
SOIC |
Pin Count
|
20 |
Terminal Form
|
Surface Mount |
Package Height
|
2.25 |
Package Length
|
13.1(Max) |
Package Width
|
7.5 |
PCB changed
|
20 |