EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
HTS
|
8542.39.00.01 |
Automotive
|
No |
PPAP
|
No |
Logic Family
|
HC |
Logic Function
|
NAND |
Number of Elements per pcs
|
4 |
Number of Element Inputs
|
2-IN |
Number of Output Enables per Element
|
0 |
Number of Selection Inputs per Element
|
0 |
Number of Element Outputs
|
1 |
Maximum Propagation Delay Time @ Maximum CL (ns)
|
95@2V |
Absolute Propagation Delay Time (ns)
|
145 |
Process Technology
|
CMOS |
Output Type
|
Open Drain |
Maximum Low Level Output Current (mA)
|
5.2 |
Maximum High Level Output Current (mA)
|
-5.2 |
Operating Supply Voltage-Min (V)
|
2 |
Typical Operating Supply Voltage (V)
|
5 |
Operating Supply Voltage-Max (V)
|
6 |
Maximum Quiescent Current (uA)
|
2 |
Propagation Delay Test Condition (pF)
|
50 |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
125 |
Packing Method
|
Tape and Reel |
Standard Package Method
|
SOP |
Original Package
|
SOIC |
Pin Count
|
14 |
Terminal Form
|
Surface Mount |
Package Height
|
1.38 |
Package Length
|
8.95(Max) |
Package Width
|
3.9 |
PCB changed
|
14 |