EU RoHS
|
Compliant |
ECCN (US)
|
EAR99 |
Part Status
|
Active |
SVHC
|
Yes |
Automotive
|
No |
PPAP
|
No |
Type
|
High Output Drive Amplifier |
Manufacturer Type
|
High Output Drive Amplifier |
Number of Channels per Chip
|
1 |
Rail to Rail
|
Rail to Rail Output |
Process Technology
|
CMOS |
Output Type
|
CMOS |
Maximum Input Offset Voltage (mV)
|
3@5V |
Minimum Single Supply Voltage (V)
|
2.7 |
Typical Single Supply Voltage (V)
|
3 |
Maximum Single Supply Voltage (V)
|
5.5 |
Maximum Input Offset Current (uA)
|
0.00006@5V |
Maximum Input Bias Current (uA)
|
0.00006@5V |
Maximum Supply Current (mA)
|
1.7@5V |
Typical Output Current (mA)
|
200@5V |
Power Supply Type
|
Single |
Maximum Power Dissipation (mW)
|
2370 |
Typical Slew Rate (V/us)
|
1.57@5V |
Typical Input Noise Voltage Density (nV/rtHz)
|
10@5V |
Typical Voltage Gain (dB)
|
95 |
Minimum PSRR (dB)
|
70 |
Minimum CMRR (dB)
|
71 |
Minimum CMRR Range (dB)
|
71 to 75 |
Typical Gain Bandwidth Product (MHz)
|
2.4 |
Shut Down Support
|
Yes |
Operating Temperature-Min
|
-40 |
Operating Temperature-Max
|
85 |
Supplier Temperature Grade
|
Industrial |
Packing Method
|
Tape and Reel |
Pin Count
|
8 |
Standard Package Method
|
SOP |
Original Package
|
HVSSOP EP |
Terminal Form
|
Surface Mount |
Package Height
|
0.95(Max) |
Package Length
|
3.1(Max) |
Package Width
|
3.1(Max) |
PCB changed
|
8 |