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    TLV2422IDR

    SKU: 57669
    Manufacturer: Texas Instruments
    Op Amp Dual Micropower Amplifier R-R O/P ±5V/10V 8-Pin SOIC T/R
    20 parts IN STOCK
    Shipped from :
    Netherlands
    Expected Ships :
    Rohs State : Need to verify

    QUANTITY

    Increments of 0 pcs
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    SVHC Yes
    Automotive No
    PPAP No
    Type Micropower Amplifier
    Manufacturer Type Micropower Amplifier
    Number of Channels per Chip 2
    Rail to Rail Rail to Rail Output
    Process Technology LinCMOS
    Output Type CMOS
    Maximum Input Offset Voltage (mV) 2@±2.5V
    Minimum Single Supply Voltage (V) 2.7
    Typical Single Supply Voltage (V) 9
    Maximum Single Supply Voltage (V) 10
    Minimum Dual Supply Voltage (V) ±1.35
    Typical Dual Supply Voltage (V) ±3
    Maximum Dual Supply Voltage (V) ±5
    Maximum Input Offset Current (uA) 0.00006@±2.5V
    Maximum Input Bias Current (uA) 0.00006@±2.5V
    Maximum Quiescent Current (mA) 0.15@5V
    Typical Output Current (mA) 50(Max)
    Power Supply Type Dual
    Maximum Power Dissipation (mW) 725
    Typical Slew Rate (V/us) 0.02@5V
    Typical Input Noise Voltage Density (nV/rtHz) 100@5V
    Typical Voltage Gain (dB) 120
    Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5V
    Minimum CMRR (dB) 70
    Minimum CMRR Range (dB) 70 to 71
    Typical Gain Bandwidth Product (MHz) 0.052
    Typical Settling Time (ns) 15500
    Shut Down Support No
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package SOIC
    Terminal Form Surface Mount
    Package Height 1.5(Max)
    Package Length 5(Max)
    Package Width 3.98(Max)
    PCB changed 8
    Products specifications
    EU RoHS Compliant
    ECCN (US) EAR99
    Part Status Active
    SVHC Yes
    Automotive No
    PPAP No
    Type Micropower Amplifier
    Manufacturer Type Micropower Amplifier
    Number of Channels per Chip 2
    Rail to Rail Rail to Rail Output
    Process Technology LinCMOS
    Output Type CMOS
    Maximum Input Offset Voltage (mV) 2@±2.5V
    Minimum Single Supply Voltage (V) 2.7
    Typical Single Supply Voltage (V) 9
    Maximum Single Supply Voltage (V) 10
    Minimum Dual Supply Voltage (V) ±1.35
    Typical Dual Supply Voltage (V) ±3
    Maximum Dual Supply Voltage (V) ±5
    Maximum Input Offset Current (uA) 0.00006@±2.5V
    Maximum Input Bias Current (uA) 0.00006@±2.5V
    Maximum Quiescent Current (mA) 0.15@5V
    Typical Output Current (mA) 50(Max)
    Power Supply Type Dual
    Maximum Power Dissipation (mW) 725
    Typical Slew Rate (V/us) 0.02@5V
    Typical Input Noise Voltage Density (nV/rtHz) 100@5V
    Typical Voltage Gain (dB) 120
    Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5V
    Minimum CMRR (dB) 70
    Minimum CMRR Range (dB) 70 to 71
    Typical Gain Bandwidth Product (MHz) 0.052
    Typical Settling Time (ns) 15500
    Shut Down Support No
    Operating Temperature-Min -40
    Operating Temperature-Max 85
    Packing Method Tape and Reel
    Pin Count 8
    Standard Package Method SOP
    Original Package SOIC
    Terminal Form Surface Mount
    Package Height 1.5(Max)
    Package Length 5(Max)
    Package Width 3.98(Max)
    PCB changed 8