|
EU RoHS
|
Compliant |
|
ECCN (US)
|
EAR99 |
|
Part Status
|
Active |
|
SVHC
|
Yes |
|
Automotive
|
No |
|
PPAP
|
No |
|
Type
|
High Speed Amplifier |
|
Manufacturer Type
|
High Speed Amplifier |
|
Number of Channels per Chip
|
1 |
|
Process Technology
|
BiCOM |
|
Maximum Input Offset Voltage (mV)
|
6@±5V |
|
Minimum Single Supply Voltage (V)
|
9 |
|
Typical Single Supply Voltage (V)
|
28 |
|
Maximum Single Supply Voltage (V)
|
33 |
|
Minimum Dual Supply Voltage (V)
|
±4.5 |
|
Typical Dual Supply Voltage (V)
|
±15 |
|
Maximum Dual Supply Voltage (V)
|
±16.5 |
|
Maximum Input Offset Current (uA)
|
0.25@±5V |
|
Maximum Input Bias Current (uA)
|
6@±5V |
|
Maximum Supply Current (mA)
|
8.5@±5V |
|
Typical Output Current (mA)
|
75@±5V |
|
Power Supply Type
|
Single |
|
Maximum Power Dissipation (mW)
|
740 |
|
Typical Slew Rate (V/us)
|
260@±5V |
|
Typical Input Noise Voltage Density (nV/rtHz)
|
7.5@±5V |
|
Typical Voltage Gain (dB)
|
81.58 |
|
Typical Noninverting Input Current Noise Density (pA/rtHz)
|
1@±5V |
|
Minimum PSRR (dB)
|
75 |
|
Minimum CMRR (dB)
|
90 |
|
Minimum CMRR Range (dB)
|
90 to 95 |
|
Typical Gain Bandwidth Product (MHz)
|
270 |
|
Typical Settling Time (ns)
|
70 |
|
Shut Down Support
|
No |
|
Operating Temperature-Min
|
0 |
|
Operating Temperature-Max
|
70 |
|
Packing Method
|
Tape and Reel |
|
Pin Count
|
8 |
|
Standard Package Method
|
SOP |
|
Original Package
|
SOIC |
|
Terminal Form
|
Surface Mount |
|
Package Height
|
1.5(Max) |
|
Package Length
|
5(Max) |
|
Package Width
|
3.98(Max) |
|
PCB changed
|
8 |